BSP, 3-axis laser marking and engraving system with base - SISMA S.p.A.

BSP

sisma / Laser systems

BSP, 3-axis laser marking and engraving system with base

Versatile
Compact, solid, with a large working chamber and a 490 mm door opening on three sides. BSP allows to work up to a max volume of 300 x 300 x 300 mm and load pieces up to 20 kg of weight.

Sturdy
Its granite structure assures durability, precision and stability over time.

Flexible
The full range of Yb laser sources supplied by SISMA can be installed on the BSP model. Together with the optional coaxial vision system (CVS) it becomes a highly productive and flexible machine.

TECHNICAL DETAILS

Technical data200F EP500F1000F
Active materialYbYbYb
Average Power 20W50W100W
Wave lenght 1064 nm1064 nm1064 nm
Working frequency1 ÷ 1000 kHz1 ÷ 500 kHz1 ÷ 4000 kHz
Impulse duration3-500 ns6-500 ns4-2000 ns
Peak power> 10 kW> 10 kW> 10 kW
Pulse energy> 1 mJ> 1 mJ> 1,2 mJ
Beam quality< 1,6< 1,6< 1,6
Cooling systemAirAirAir
Axis stroke (XYZ)300 mm x 300 mm x 300 mm300 mm x 300 mm x 300 mm300 mm x 300 mm x 300 mm
Max piece weight20 kg20 kg20 kg
Precision0,05 mm0,05 mm0,05 mm
Repeatability0,02 mm0,02 mm0,02 mm
Power supply230 V ± 15% 50/60 Hz - single phase - CEE 16A socket230 V ± 15% 50/60 Hz - single phase - CEE 16A socket230 V ± 15% 50/60 Hz - single phase - CEE 16A socket
Power absorption1 kW1 kW1 kW
Dimensions (L x D x H)823 mm x 1329 mm x h 1904 mm (h 2400 mm with open door)823 mm x 1329 mm x h 1904 mm (h 2400 mm with open door)823 mm x 1329 mm x h 1904 mm (h 2400 mm with open door)
Weight590 kg590 kg590 kg

Applications BSP

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